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Robotic Arm Development

Trusting us with your future

What we do

At Circuit Engineering, we specialize in providing advanced PCB manufacturing services with a strong focus on quality, precision, and timely delivery. Our capabilities span across a wide range of PCB solutions, from single-layer to multi-layer boards, including high-frequency, rigid, flexible, and hybrid designs. With state-of-the-art manufacturing facilities in Elk Grove Village, USA, China, and India, we are able to offer tailored solutions that meet the most demanding requirements.

Our U.S. facility is equipped with the latest in PCB manufacturing technology, ensuring that we can handle rapid prototyping, small to medium-scale production runs, and high-mix, low-volume projects. This facility allows us to provide fast turnaround times and maintain tight control over quality.

Our offshore operations in China and India offer competitive pricing while maintaining rigorous quality standards. These locations are equipped with advanced equipment for high-volume production, enabling us to meet large-scale orders and provide cost-effective solutions without compromising quality.

Whether it’s a quick-turn prototype, a low-volume custom order, or a large production run, we have the capacity to meet your needs. Our engineers work closely with customers to offer comprehensive support in design for manufacturability (DFM), assembly services, and end-to-end logistics, ensuring that the final product meets the highest industry standards.

In addition to traditional PCBs, we also offer advanced services such as custom assembly, testing, and packaging, ensuring that all components are fully integrated and ready for deployment. From aerospace to consumer electronics, automotive, telecommunications, and medical industries, our solutions support a wide variety of sectors, all with a focus on delivering high-quality, reliable, and cost-effective products.

CAPABILITIES

  • Board type 1,2,3,4

  • Type 1-Single sided

  • Type 2-Double sided

  • Type 3-Multilayer

  • Type 4-multilayer with blind and/or buried vias

  • Aluminum boards

  • Double sided boards

  • Multi-layer boards

  • Multi-layer boards 16 layers

  • IPC Slash Sheet

  • Electrolytic nickel gold edge connectors

  • Back drilling

  • Castellations/half hole

  • Via protection type I, II, III, IV, V, VII

  • Non-conductive and conductive via fill

  • LF-HASL

  • HASL

Image by Vishnu Mohanan

CAPABILITIES

  • Heavy copper

  • Blind via

  • Hybrid boards

  • Rigid pcb

  • Flex pcb

  • Rigid flex pcb

  • Through holes, blind vias, via in pad

  • Impedance

  • Edge plating

  • Pockets

  • Gold bondable

  • OSP

  • ENIG

  • Immersion Silver

  • Immersion Tin

  • Electrolytic nickel gold edge connectors

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